Ipc 9704 pdf download

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

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We would like to thank them for their dedication to this effort. Any document involving a complex technology draws material from a vast number of sources. While the principal members of the SMT Attachment Reliability Test Methods Task Group are shown below, it is not possible to include all of those who assisted in the evolution of this standard. Neil Adams, Circuit Check Inc. Michael Azarian, University of Systems, Inc. Shepherd, Microtek Trevor S. Bowers, Adtran Inc.

Dennis Fritz, MacDermid, Inc. John H. David D. Hillman, Rockwell Collins Corporation. The method describes specific guidelines for strain gage testing of PCAs during the printed board manufacturing process, including assembly, test, system integration, and other types of operations that may induce board flexure.

The suggested procedure enables printed board assemblers to conduct strain gage testing independently, and provides a quantitative method for measuring board flexure, and assessing risk levels. In certain cases, the described test approach may be used for non-area-array discrete SMT devices such as capacitors or resistors. Characterization of worst-case PCA strain is critical due to the susceptibility of component interconnects to strain-induced failures. Excessive strain can result in various failure modes for different solder alloys, package types, surface finishes, or laminate materials.

Such failures include solder ball cracking, trace damage, laminate related adhesive failure pad lifting or cohesive failure pad cratering and package substrate cracking see Figure However, with the rapid transition to lead-free assembly technology, increased interconnect densi- ties, and new laminate materials, the potential for flexure-induced damage has increased. Many board assemblers are now required to operate under strain levels specified by their customers or component suppliers.

As strain measurement technology has matured, different methodologies have developed. Variations in strain gage method- ology inhibit reliable data collection and prevent data comparison across the industry. This document provides a standard- ized set of guidelines to address variations in gage mounting, gage placement, experiment design, data acquisition system variables, and strain metrics.

PCA strain measurement includes application of strain gages to the printed board near specified components, followed by subjecting the instrumented board to various test, assembly, and handling operations. Steps which exceed strain limits are deemed excessive and are identified so that corrective actions can be made. Strain limits may come from the customer, com- ponent supplier or internal best known practices. Examples of strain measurement criteria are shown in the www.

By identifying areas sensitive to manufacturing variation, strain gage testing provides insight into the effects of a produc- tion ramp. Strain gage measurements become the baseline for future process improvement activities, and quantify the effec- tiveness of adjustments. Manufacturing steps that are typically characterized are listed below: 1. Figure Examples of Solder Joint Damage top: pad cratering, bottom left: bulk solder joint failure, bottom right: solder interfacial fracture.

Shipping and Handling. Assembly processes for different printed boards and assemblers vary. Tests such as ICT and BFT are referred to generically in this document; nomenclature can vary at different manufacturing sites. In such cases, apply the same requirements to the equivalent test processes. However, the goal is to characterize all assembly steps involving mechanical loading. Do not con- strain testing to the steps listed above, or only to perceived high risk areas.

The data from these tests can serve as a base- line for future reference. This includes components with end-cap terminations such as chip capacitors or resistors.

IPCa 1. Diagonal strain and prin- cipal strain are two possible strain metrics. Changes to a figure or table are indicated by gray shading of the figure caption or table header.

Subsequent issues of, or amendments to, these documents will become a part of this specification. Informative documents listed below are for reference only. Figure shows the steps for printed circuit assembly and Figure for system assembly.

Example manufacturing assembly and test steps where strain measurements should typically be taken are depicted by the strain measurement icon in Figure and Figure Multiple iterations or actuations of each process step can help char- acterize the associated process variance.

This can also provide insight into situations where there is complex bending. Wave Solder. Typically, a minimum of two test boards are instrumented. They are not required to be electrically functional but must mechanically represent the latest design.

Characterization of the system assembly process might require additional test boards. If a device under test is strained to a point where damage may have occurred, the system should be evaluated to ensure that accurate data can still be assessed using this test board. The first instrumented printed board should reflect a printed circuit assembly PCA that has been through SMT reflow, just prior to wave solder.

An example is shown in Figure At this stage, the board contains only SMT components. As can be seen in Figure , appropriate wire management is important for these boards. Bundling and securing the wires with heat resistant tape or ties is important when preparing these boards.

The wires should be run between components, where they will not interfere with any process steps. This printed board should not be used for the characterization of assembly steps after wave solder. Example gage location. Wires bundled and secured. The second instrumented printed board should be similar to PCAs that have completed wave solder.

As with the previous board Figure , appropriate wire management practices should be followed. A typical ICT strain gage test setup is illustrated in Figure Wires bundled and secured away from hold-down posts. All assembly steps should be characterized. Attention should also be paid to processes where mechanical fixtures are used, e. Where racks or trays are used, process steps such as stor- age and board transfer, should also be considered.

It is strongly recommended that any manual handling between assembly steps, with or without fixtures, be characterized. If the manual handling steps are similar, combining the handling test into one test run, representative of worst-case handling, is acceptable. Details of this manual handling simulation must be documented in the test report. Simulations should also be conducted to quantify the associated variability.

There may be unique manufacturing processes that require alternative configurations. For example, through-hole components typically require wave solder. Wave solder conventionally follows convection reflow one or two passes depending on board layout. In cases where assembly characterization prior to wave solder is required, the test board shall be mechanically representative of boards prior to SMT reflow. In such instances, alternative set-ups are acceptable as long as all mechanical loading characterization requirements are met.

It is recommended that test boards be inspected for excessive warpage prior to instrumentation. Another possible consider- ation would be the effect of solder aging, i. This should be considered when interpreting the results. If there are several fine pitch components, then, at a minimum, the three worst case locations should be tested based on engineer- ing judgment, history of damage, or finite element analysis.

The above represents one of the methods that may be employed as a criterion for characterization.

 
 

 

Ipc 9704 pdf download.IPC 9704 PDF

 

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Already Subscribed to document. In this seminar you will to recognize all the influencing quantities relevant to measurement uncertainty. This seminar is intended for all those who are keen on learning how to install strain gauges on printed circuit boards and perform measurements using strain gauges.

Describes specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure. Careers and apprenticeships Equal opportunities Vacancies Apprenticeships. Regrettably, indication of copyright fee is not available. Please first log in with a verified email before subscribing to alerts. Electronic books The e-book database EBC.

Spain, France, and Italy. Standards Subscriptions from ANSI provides a money-saving, multi-user solution for accessing standards. Additionally, our experienced trainers will educate you about the most important jpc foundations of the functioning and wiring of strain gauges as as data acquisition topics. Engineering Index Backfile Table of contents conference proceedings The ipx of contents of the conference proceedings is generated automatically, so it can be incomplete, although all articles are available in the TIB.

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